Wire bonding method

Details Wire bonding method Wire bonding method

1990-03-05

1992-01-07

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 11, 228179, B23K 2010, H01L 21607

Patent

active

050783122

ABSTRACT:
A wire bonding method wherein a bonding tool is lowered in a pre-loaded state, and bonding is performed under a bonding load which is smaller than the pre-loading load. The pre-loading load is changed to the bonding load before the bonding tool contacts a bonding point, and the bonding tool contacts the bonding point under such bonding load, thus performing bonding. Such bonding is performed also by changing the pre-loading load into a load which is smaller than the bonding load before the bonding tool contracts a bonding point and further changing such load into the bonding load after the bonding tool has contacted the bonding point.

REFERENCES:
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4789095 (1988-12-01), Kobayashi

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