Wire bonding method

Details Wire bonding method Wire bonding method

1991-01-25

1992-05-26

Seidel, Richard K.

Metal fusion bonding

Process

Using high frequency vibratory energy

228102, 228904, B23K 106, B23K 3102

Patent

active

051159600

ABSTRACT:
A wire bonding method for connecting a chip electrode on a semiconductor chip and a lead through metal wire is described. The wire bonding method includes transmitting a first ultrasonic oscillation to the metal wire before the contact time of the metal wire, and transmitting a second ultrasonic oscillation to the metal wire after the contact time of the metal wire. The first ultrasonic oscillation is relatively small and suitable for bonding the metal wire in contact with the chip electrode or the lead. The second ultrasonic oscillation is relatively large and suitable for bonding the metal wire crushed by the chip electrode or the lead.

REFERENCES:
patent: 4496095 (1985-01-01), Renshaw et al.
patent: 4571688 (1986-02-01), Kashihara
patent: 4597519 (1986-07-01), Kurtz et al.
patent: 4696425 (1987-09-01), Landes
patent: 4789095 (1988-12-01), Kobayashi
patent: 4993618 (1991-02-01), Toyozawa et al.

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