Wire bonding method

Details Wire bonding method Wire bonding method

1992-02-27

1993-03-09

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228 45, B23K 3102

Patent

active

051920182

ABSTRACT:
In a wire bonding method in which a capillary is raised from a first bonding point after bonding and then moved in a direction opposite to a second bonding point, thus making a reverse action, such a reverse action is made in a circular-arc shape around a neck part of the wire at the first bonding point. Thus, an ideal wire-looping is accomplished, thus preventing wire damage which could be caused by reverse actions.

REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4445633 (1984-05-01), Bonham, Jr.
patent: 4932584 (1990-06-01), Yamazaki et al.

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