Wire bonding method

Details Wire bonding method Wire bonding method

1992-02-27

1992-10-20

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

H01L 2160

Patent

active

051563231

ABSTRACT:
In a bonding method used in manufacturing semiconductor devices, after a bonding wire is connected to a first bonding point, a capillary is moved straight up and then moved away from a second bonding point, thus making a first reverse action. From there, the capillary is again raised and a second reverse action is performed so that the capillary is moved again in the direction opposite to the second bonding point. The capillary is further raised with feeding out the wire for the length which is enough to make a wire loop, and then the capillary is moved down to the second bonding point where the bonding is performed.

REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4445633 (1984-05-01), Bonham, Jr.

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