Wire bonding method

Details Wire bonding method Wire bonding method

1997-10-06

2000-06-27

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

2281101, 22818022, B23K 3100, B23K 3102, B23K 106, B23K 520

Patent

active

060796103

ABSTRACT:
A ball is formed at the tip of a wire projecting from a capillary. The capillary is positioned above an interconnection, and ball bonding forms a bump on the interconnection. The capillary is then moved next to the bump and wedge bonding is carried out. Next, the capillary is moved upward and another ball is formed at the tip of the wire, and the wire is primary bonded to a bonding pad of a semiconductor chip. The wire is then looped and the capillary is positioned above the bump, and secondary bonding is carried out. As a result, the formation of tails on the bump is prevented.

REFERENCES:
patent: 4442967 (1984-04-01), van de Pas et al.
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5172851 (1992-12-01), Matsushita et al.
patent: 5299729 (1994-04-01), Matsushita et al.
patent: 5328079 (1994-07-01), Mathew et al.
patent: 5364009 (1994-11-01), Takahashi et al.
patent: 5485949 (1996-01-01), Tomura et al.
patent: 5842628 (1998-12-01), Nomoto et al.

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