Wire bonding method

Details Wire bonding method Wire bonding method

1994-09-23

1997-07-15

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156322, 20419232, 437190, 437210, 437246, B32B 3100

Patent

active

056479425

ABSTRACT:
The wire bonding method of the present invention comprises a step of removing a thin surface layer of an electrode comprising a copper layer and a nickel layer formed on the surface of the copper layer and coated with gold on the surface, to thereby remove nickel hydroxide and nickel oxide present on the gold film and a step of electrically connecting a pad of a semiconductor chip fixed with a bonding agent on the substrate through an electrically conductive wire to the nickel hydroxide nickel oxide-eliminated electrode.

REFERENCES:
patent: 4188438 (1980-02-01), Burns
patent: 4754317 (1988-06-01), Comstock et al.
patent: 4902551 (1990-02-01), Nakaso et al.
patent: 5165590 (1992-11-01), Cini et al.
patent: 5341980 (1994-08-01), Nishikawa et al.

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