Wire bonding method

Details Wire bonding method Wire bonding method

1991-01-25

1992-09-22

Rowan, Kurt

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 11, 228110, B23K 106, B23K 3700, B23K 3112

Patent

active

051489643

ABSTRACT:
A wire bonding method for connecting an electrode pad on a semiconductor chip and an inner lead of a lead frame through a metal wire is described. The wire bonding method is performed by moving a bonding tool holding the wire metal. The method comprises the steps of calculating the height difference between the electrode pad and the inner lead, determining a reverse movement amount of the bonding tool according to the height difference, and reversing the bonding tool horizontally at a predetermined level by the determined reverse movement amount while raising vertically the bonding tool. According to the present invention, the amount of reverse movement of the bonding tool may be automatically changed in accordance with the height difference and without reliance on an operator.

REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4445633 (1984-05-01), Bonham, Jr.
patent: 4610387 (1986-09-01), Scavino
patent: 4932584 (1990-06-01), Yamazaki et al.
patent: 4958762 (1990-09-01), Shimizu et al.

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