Wire bonding method

Details Wire bonding method Wire bonding method

1990-06-06

1992-06-23

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, H01L 2160

Patent

active

051235854

ABSTRACT:
A wire bonding method in which a bonding tool is lowered fast toward a bonding surface and the lowering speed of the bonding tool is then reduced at a speed-change point near the bonding surface, wherein a bonding level at which the bonding tool contacts with the bonding surface is detected and stored in a memory, and the following speed-change points of the lowering motion of the bonding tool are automatically determined in accordance with the previously detected bonding level.

REFERENCES:
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4444349 (1984-04-01), Bilane et al.
patent: 4789095 (1988-12-01), Kobayashi
patent: 4855928 (1989-08-01), Yamanaka

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