Wire bonding machine capable of removing particles from...

Details Wire bonding machine capable of removing particles from... Wire bonding machine capable of removing particles from...

2005-09-16

2010-10-12

Kerns, Kevin P (Department: 1793)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500

Reexamination Certificate

active

07810695

ABSTRACT:
A wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip uses a grinding film of the wire bonding machine mounted on a clamp block. The capillary of the wire bonding machine periodically moves on the grinding film and then, the bottom tip of the capillary is rubbed with and moves on the grinding film at a predetermined distance, whereby various particles formed at the bottom tip of the capillary are removed.

REFERENCES:
patent: 2378271 (1945-06-01), Wheildon, Jr.
patent: 3136614 (1964-06-01), Kuzmick
patent: 5221291 (1993-06-01), Imatani et al.
patent: 6474538 (2002-11-01), Yonezawa et al.
patent: 6863206 (2005-03-01), Kyomasu et al.
patent: 2002/0096187 (2002-07-01), Kuwata et al.
patent: 2005/0061849 (2005-03-01), Takahashi

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