Wire bonding inspection equipment

Details Wire bonding inspection equipment Wire bonding inspection equipment

1991-09-12

1992-10-20

Seidel, Richard K.

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

228 45, 228104, B23K 3700, B23K 3112

Patent

active

051563193

ABSTRACT:
Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor device is judged to be defective. In response to the defect signal wires of the defective semiconductor device are broken by a breaking unit, and a defect mark is applied on the defective semiconductor device by a defective mark putting unit in response to the defect signal, the defect mark applying unit applying the defect mark on an area other than an area to be covered with sealing material.

REFERENCES:
patent: 5007576 (1991-04-01), Congleton et al.
patent: 5029747 (1991-07-01), Russo et al.

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