Wire bonding inspecting apparatus utilizing a controlling means

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

Patent

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Details

356394, 358106, G01N 2186

Patent

active

051381800

ABSTRACT:
To inspect the wire bonding of semiconductor chips of different sizes and with a broader allowability of chip mislocation on an inspection table, the inspecting apparatus includes an inspection base on which a chip is mounted; an illuminator for illuminating the wires to be inspected; an optical cylinder for forming an optical image of the wires; a video unit for generating video signals; an image processing unit for recognizing wire shapes and measuring wire bonded positions; a storage unit for storing inspection criteria; a main controller for comparing the recognized wire shapes and the measured wire bonded positions with the stored criteria to decide on chip acceptance or unacceptance; and, in particular, an x-y table for moving the optical cylinder relative to the inspection base or vice versa; and a controller for controlling the relative positional relationship between the two, so that an inspection area can be image-formed by the optical cylinder at a correct inspection position.

REFERENCES:
patent: 4200393 (1980-04-01), Suzuki et al.
patent: 4203132 (1980-05-01), Schmitt
patent: 4874956 (1989-10-01), Kato et al.

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