Wire bonding external appearance inspecting apparatus

Details Wire bonding external appearance inspecting apparatus Wire bonding external appearance inspecting apparatus

1991-10-09

1993-07-06

Evans, F. L.

Optics: measuring and testing

By polarized light examination

With light attenuation

356237, 356394, 358101, 358106, G01B 1124, G01N 2188

Patent

active

052258912

ABSTRACT:
A wire bonding external appearance inspecting apparatus for inspecting wires bonded to a semiconductor chip and the vicinity thereof, comprises a plurality of illuminating units of different illumination directions, for illuminating the semiconductor chip and the vicinity thereof, and a controller for selecting and operating any one of the plural illuminating units according to the inspection places thereof. Since an optimum illumination can be obtained according to inspection items, a camera can take plural different images according to objects to be inspected, so that the inspection reliability can be improved.

REFERENCES:
patent: 5030008 (1991-07-01), Scott et al.

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