Wire-bonding equipment

Details Wire-bonding equipment Wire-bonding equipment

1976-02-13

1977-08-02

Jones, Jr., James L.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, 228 6A, 228 7, H01L 21607, B23K 2102

Patent

active

040391140

ABSTRACT:
Wire-bonding equipment has jigs which may be secured on a mounting support whereat an electronic or other module may be loaded onto a jig and moved into a correct alignment observable on a television screen, and the jigs are transportable from the mounting support location to a positioning table location whereat successive jigs are automatically moved in a requisite manner to bring successive terminals of modules loaded thereon to a position for bonding of wires thereto by a simultaneously actuated wire-bonder unit, after which successive jigs are transported back to the mounting support to permit unloading of a wired module and loading of a new module. Since the disclosed equipment permits use of ultrasonic bonding means, and requires only simple, easily observable actions by an operator, the equipment is particularly suited to wiring of microelectronic modules.

REFERENCES:
patent: 3928749 (1975-12-01), Hermann
patent: 3946931 (1976-03-01), Bahnek

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