Wire bonding device

Details Wire bonding device Wire bonding device

1992-06-02

1993-04-06

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 9, H01L 2160, H05K 332

Patent

active

051996286

ABSTRACT:
A wire bonding device which comprises a height detector that detects the surface height of a semiconductor pellet, a position detector that detects the two-dimensional position of the semiconductor pellet, and a bonding head controller that controls a bonding tool, which changes the search height for the bonding operation according to the surface height of the semiconductor pellet detected by the height detector, to thereby make the bonding load constant and stabilize the ahdesive strength of the wire in the wire bonding.

REFERENCES:
patent: 3941486 (1976-03-01), Tyler
patent: 4109846 (1978-08-01), Pennings et al.
patent: 5060841 (1991-10-01), Oshima et al.

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