Wire bonding deflector for a wire bonder

Details Wire bonding deflector for a wire bonder Wire bonding deflector for a wire bonder

2011-04-05

2011-04-05

Stoner, Kiley (Department: 1735)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S015100, C228S904000

Reexamination Certificate

active

07918378

ABSTRACT:
Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.

REFERENCES:
patent: 3289452 (1966-12-01), Hartwig
patent: 3750926 (1973-08-01), Sakamoto et al.
patent: 4030657 (1977-06-01), Scheffer
patent: 4594493 (1986-06-01), Harrah et al.
patent: 4667867 (1987-05-01), Dobbs et al.
patent: 4776509 (1988-10-01), Pitts et al.
patent: 5558270 (1996-09-01), Nachon et al.
patent: 5816472 (1998-10-01), Linn
patent: 5899375 (1999-05-01), Yoshida et al.
patent: 6267290 (2001-07-01), Murdeshwar
patent: 6564989 (2003-05-01), Arakawa
patent: 6708403 (2004-03-01), Beaman et al.
patent: 6896170 (2005-05-01), Lyn et al.
patent: 7216794 (2007-05-01), Lange et al.
patent: 7249702 (2007-07-01), Mironescu et al.
patent: 2002/0117330 (2002-08-01), Eldridge et al.
patent: 2006/0273140 (2006-12-01), Ghosh
patent: 54005383 (1979-01-01), None
patent: 54152962 (1979-12-01), None
patent: 04206841 (1992-07-01), None
patent: 07147296 (1995-06-01), None
patent: 10056034 (1998-02-01), None
patent: 2000012598 (2000-01-01), None

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