Wire bonding capillary tool having multiple outer steps

Details Wire bonding capillary tool having multiple outer steps Wire bonding capillary tool having multiple outer steps

2006-04-10

2009-10-06

Ward, Jessica L (Department: 1793)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S110100, C228S180500

Reexamination Certificate

active

07597231

ABSTRACT:
A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof, said working tip portion having an annular chamfer at the tip thereof; wherein the concentric capillary opens into the annular chamfer of the working tip, and wherein the diameter of the cylindrical portion decreases consecutively at a plurality of discrete intervals along the length of the cylindrical portion towards the working tip portion.

REFERENCES:
patent: 5503321 (1996-04-01), Urushima
patent: 5884835 (1999-03-01), Kajiwara et al.
patent: 6321969 (2001-11-01), Miller
patent: 6523733 (2003-02-01), Miller et al.
patent: 6910612 (2005-06-01), Perlberg et al.
patent: 2002/0033408 (2002-03-01), Miller et al.
patent: 2003/0146267 (2003-08-01), Mayer et al.
patent: 2004/0188499 (2004-09-01), Nosaka
patent: 2005/0252950 (2005-11-01), Eder et al.
patent: 2005/0275073 (2005-12-01), Kawakami et al.
patent: 2 285 943 (1995-08-01), None
patent: 9-260416 (1997-10-01), None

Affiliated with

Also associated with

Rating

Wire bonding capillary tool having multiple outer steps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding capillary tool having multiple outer steps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding capillary tool having multiple outer steps will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4077017