Wire bonding capillary

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2281805, B23K 2010

Patent

active

056622619

ABSTRACT:
A multiple face angle wire bonding capillary of the present invention has an elongated hole therethrough terminating at one end of the capillary tip, and a face on the end of the capillary tip extending away from the hole at multiple angles of increasing magnitude.

REFERENCES:
patent: 4415115 (1983-11-01), James
patent: 4886200 (1989-12-01), Tsumura
patent: 5003373 (1991-03-01), Tsumuru et al.
patent: 5172851 (1992-12-01), Matsushita et al.
patent: 5421503 (1995-06-01), Perlberg et al.
"Thermosonic Capillaries For Fine Pitch Bonding," Small Precision Tools, Petaluma, California, 1988.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wire bonding capillary does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding capillary, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding capillary will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-301424

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.