Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate
2010-01-29
2010-12-28
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
With condition responsive, program, or timing control
C228S004500, C228S008000, C228S103000, C228S105000, C228S180500
Reexamination Certificate
active
07857190
ABSTRACT:
A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.
REFERENCES:
patent: 4213556 (1980-07-01), Persson et al.
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4597519 (1986-07-01), Kurtz et al.
patent: 4603802 (1986-08-01), Kurtz et al.
patent: 4815001 (1989-03-01), Uthe et al.
patent: 4998664 (1991-03-01), Gibson et al.
patent: 5170062 (1992-12-01), Miyahara
patent: 5212361 (1993-05-01), Miyazaki et al.
patent: 5213249 (1993-05-01), Long et al.
patent: 5214259 (1993-05-01), Terakado et al.
patent: 5326015 (1994-07-01), Weaver et al.
patent: 5433369 (1995-07-01), Okumura
patent: 5458280 (1995-10-01), Nishimaki et al.
patent: 5615821 (1997-04-01), Sasano
patent: 5763849 (1998-06-01), Nakao
patent: 5988482 (1999-11-01), Sasakura et al.
patent: 6070778 (2000-06-01), Takahashi et al.
patent: 6085962 (2000-07-01), Jacobson et al.
patent: 6179197 (2001-01-01), Toner
patent: 6206266 (2001-03-01), Takahashi et al.
patent: 6337453 (2002-01-01), Miller et al.
patent: 6492828 (2002-12-01), Ming-Hsun et al.
patent: 2001/0004991 (2001-06-01), Mochida et al.
patent: 2001/0016786 (2001-08-01), Takahashi et al.
patent: 2001/0042772 (2001-11-01), Narita et al.
patent: 2003/0098426 (2003-05-01), Hayata
patent: 2003/0178469 (2003-09-01), Hess et al.
patent: 2005/0284914 (2005-12-01), Beatson et al.
patent: 2006/0208029 (2006-09-01), Suzuki et al.
patent: 2010/0155455 (2010-06-01), Mii et al.
patent: S55-111143 (1980-08-01), None
patent: S60-242627 (1985-12-01), None
patent: S62-104126 (1987-05-01), None
patent: 2-298874 (1990-12-01), None
patent: 3-17376 (1991-03-01), None
patent: 03-263844 (1991-11-01), None
patent: H04-012544 (1992-01-01), None
patent: 58-034938 (1993-03-01), None
patent: 6-5651 (1994-01-01), None
patent: H07-037923 (1995-02-01), None
patent: 7-94545 (1995-04-01), None
patent: H10-107059 (1998-04-01), None
patent: 2003-163243 (2003-06-01), None
Maki Shinji
Mori Noriko
Suzuki Noriko
Takahashi Kuniyuki
Tei Shinsuke
DLA Piper (LLP) US
Kabushiki Kaisha Shinkawa
Stoner Kiley
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