Wire bonding apparatus and wire bonding method

Details Wire bonding apparatus and wire bonding method Wire bonding apparatus and wire bonding method

1995-10-05

1997-08-05

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 45, H01L 2160

Patent

active

056533802

ABSTRACT:
An electrode of a chip and an electrode of a substrate are connected by a wire drawn out from a lower end of a capillary tool. When the wire accidentally gets into the capillary tool and thus is not drawn out from the lower end of the capillary tool, a suction unit is operated to automatically draw out the wire from within the capillary tool using a suction force. A cutter is provided in the suction unit for cutting the sucked wire such that the wire of a given length remains to be drawn out from the lower end of the capillary tool.

REFERENCES:
patent: 4069961 (1978-01-01), Nicklaus et al.
patent: 4928871 (1990-05-01), Farassat
patent: 4998002 (1991-03-01), Okikawa et al.

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