Wire bonding apparatus and process

Details Wire bonding apparatus and process Wire bonding apparatus and process

2008-08-26

2009-12-29

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500

Reexamination Certificate

active

07637411

ABSTRACT:
A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.

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patent: 5988481 (1999-11-01), Torihata et al.
patent: 7431192 (2008-10-01), Sadler
patent: 2004/0217100 (2004-11-01), Ogimoto et al.
patent: 1098362 (2001-05-01), None
patent: 1313139 (2008-08-01), None
International Search Report dated May 30, 2006, International Application No. PCT/US2005/045320.

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