Metal fusion bonding – Process – Plural joints
Patent
1996-11-25
1998-08-25
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
228 45, 219 5621, 219 5622, H01L 2160
Patent
active
057973881
ABSTRACT:
In a wire-bonding machine and method that uses a covered wire, discharge electrodes comprise a pair of discharge electrodes for covering-film removal, in which the upper and lower surfaces of electromagnetic parts used as discharge terminals are held by two insulating parts, and a discharge electrode for ball formation, which is movable together with one of the pair of discharge electrodes for covering-film removal. The discharge electrodes for covering-film removal are positioned so as to be in close proximity to, but not in contact with, the side surfaces of the portion of the covered wire corresponding to an intended second bonding point during the removal of the covering-film from the portion corresponding to the intended second bonding point, and the discharge electrode for ball formation is positioned to one side of the covered wire when the discharge electrodes for covering-film removal are opened, and when the capillary is raised to the ball formation level, the tip of the covered wire is positioned to one side of the discharge electrode for ball formation.
REFERENCES:
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5370300 (1994-12-01), Okumura
Nakamura Osamu
Sasakura Kazumasa
Kabushiki Kaisha Shinkawa
Knapp Jeffrey T.
Ryan Patrick
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