Wire bonding apparatus and method

Details Wire bonding apparatus and method Wire bonding apparatus and method

1993-10-13

1995-07-18

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228 45, 228 42, 228206, B23K 3538, B23K 3102

Patent

active

054333717

ABSTRACT:
A wire bonding apparatus has a sealed casing having an opening which can be opened and closed, a device for gas-tightly dividing the casing into first and second chambers, a sealing device that is movable for communicating the two chambers with each other, a device for supplying an inert gas into the first chamber, a device for supplying oxygen gas or ozone gas into the second chamber, a device for connecting an electrode of the substrate to an electrode of the semiconductor chip via the wire in the first chamber, a device for generating glow discharge in the second chamber, and a device for transporting the substrate between the first and second chambers. Wire bonding is immediately performed after impurities are removed from the electrodes by electrical discharge.

REFERENCES:
patent: 4159075 (1979-06-01), Ljung et al.
patent: 5192582 (1993-03-01), Liedke et al.

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