Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1994-01-19
1995-07-18
Heinrich, Samuel M.
Metal fusion bonding
Process
Using high frequency vibratory energy
228102, 228 11, 228 8, H01L 21607, B23K 2010
Patent
active
054333695
ABSTRACT:
A wire bonding apparatus realizing stable bonding by supplying a constant electric power to a joint. Under loadless conditions, an electric-power calculation circuit calculates the power supply from a feedback current and oscillating voltage corresponding to a level setting signal set to a level change circuit. When the tip of a bonding wire contacts a bond electrode, the feedback current gets smaller than that under loadless conditions and the power supply decreases. The electric-power calculation circuit calculates the power supply from the feedback current and oscillating voltage and a correction circuit outputs a control voltage for complementing a decrease of power supply accumulated since the loadless state. A level change circuit converts an oscillating voltage into a level corresponding to the control voltage. Thereby, the electric power to be supplied to the joint is kept constant. A PLL circuit controls an oscillator so that the phase of the oscillated output coincides with that of the feedback current to prevent the electric power from decreasing due to the phase difference between the output and the current.
REFERENCES:
patent: 4341574 (1982-07-01), Landes
patent: 4808948 (1989-02-01), Patel et al.
patent: 4824005 (1989-04-01), Smith, Jr.
patent: 5044543 (1991-09-01), Yamazaki et al.
patent: 5046654 (1991-09-01), Yamazaki et al.
patent: 5176311 (1993-01-01), Levine et al.
patent: 5213249 (1993-05-01), Long et al.
patent: 5238173 (1993-08-01), Ura et al.
Semicon NEWS, Feb. 1990, p. 80, "High Speed Wire Bonding Apparatus Acceptable for Multi-pin System" by Takaji Tsujimura.
Heinrich Samuel M.
Rohm & Co., Ltd.
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