Metal fusion bonding – Process – Plural joints
Patent
1994-07-20
1995-09-26
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228 45, H01L 2160, B23K 2600
Patent
active
054528410
ABSTRACT:
A wire bonding apparatus and method which enable fully automatic wire bonding between a connecting electrode on a circuit board and an external lead terminal while saving space to prevent enlargement of the package size. The wire bonding method has the steps of welding one end of a ribbon shaped flat copper wire to the terminal (external lead terminal); welding the other end of the copper wire to the pad (connecting electrode) which is disposed at a level below the level of the terminal, while turning the intermediate portion of the copper wire on and around the cylindrical portion of the forming member which is disposed at a level above the terminal within the horizontal span between the pad and the terminal; and depressing the bent portion of the copper wire which has been bent by being turned around the cylindrical portion of the forming member down to a level below the level of the terminal so that the copper wire, within the vertical span between the pad and the terminal, is bent to form the first acute bend and then bent back to form the second acute bend and then extended to the pad.
REFERENCES:
patent: 4378902 (1983-04-01), Fedak
"Stabilized Long wire Bonding Technique", Research Disclosure, Jan. 1992, No. 333, Kenneth Mason Publications Ltd. England.
Journal of Nippondenso Technical Disclosure, No. 58-138.
Journal of Nippondenso Technical Disclosure, No. 58-131.
Journal of Nippondenso Technical Disclosure, No. 52-241.
Ogino Akihiko
Sakou Shuji
Sibata Sinji
Heinrich Samuel M.
Nippondenso Co. Ltd.
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