Wire bonding apparatus and control method thereof

Details Wire bonding apparatus and control method thereof Wire bonding apparatus and control method thereof

1998-05-14

2000-06-06

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 8, 228102, 2281805, B23K 3700, B23K 1308, B23K 1502, B23K 3100, B23K 3102

Patent

active

06070778&

ABSTRACT:
In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.

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patent: 5158223 (1992-10-01), Shimizu
patent: 5207370 (1993-05-01), Mochida et al.
patent: 5443200 (1995-08-01), Arikado
patent: 5566876 (1996-10-01), Nishimaki et al.
patent: 5579984 (1996-12-01), Sasano
patent: 5586713 (1996-12-01), Arita et al.

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