Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1992-05-07

1993-06-15

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 8, H01L 21603

Patent

active

052191125

ABSTRACT:
In a bonding apparatus for semiconductor devices, etc., a linear sensor is mounted on a bonding head frame. An arm holder which has a bonding capillary at one end is pivotally mounted to the bonding head frame, and the linear sensor is positioned so that it faces a middle portion of the arm holder which locates an opposite side of pivotal point of the arm holder from the capillary. The linear sensor detects the gap between the arm holder and the bonding head frame when the arm holder pivots, thus determining the bonding surface level of a workpiece by the capillary which comes into contact with the workpiece.

REFERENCES:
patent: 4438880 (1984-03-01), Smith et al.
patent: 4984730 (1991-01-01), Gobel et al.
patent: 5060841 (1991-10-01), Oshima et al.

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