Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1983-01-27

1985-07-09

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 45, B23K 3704, B23K 106

Patent

active

045277303

ABSTRACT:
A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding tool, is disposed in proximity of the bonding tool which moves relative to the article to be wire bonded and which connects the wire between a first bonding region and the second bonding region. A mechanism is provided which changes the shape of the loop of the bonding wire when the wire guide unit moves vertically and transversely.

REFERENCES:
patent: 3646307 (1972-02-01), Hazel
patent: 3650450 (1972-03-01), Larson et al.
patent: 4068371 (1978-01-01), Miller
patent: 4230925 (1980-10-01), Lascelles
patent: 4418858 (1983-12-01), Miller

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