Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1991-05-31

1992-10-27

Seidel, Richard K.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228110, 228904, B23K 2010

Patent

active

051582236

ABSTRACT:
A wire bonding apparatus for connecting a chip electrode of a semiconductor chip and an inner lead of a lead frame through a bonding wire is described. The apparatus is provided with an X-Y table having a bonding head. An ultrasonic horn is attached rotatably to the bonding head, and extends in the Y direction. The ultrasonic horn has a capillary which holds the bonding wire. A Y table moving calculator which calculate a Y direction moving amount of the X-Y table, while taking a Z direction moving amount of the capillary into account, is provided. A signal from the Y table moving calculator is inputted to a Y table controller which controls Y direction movement of the X-Y table.

REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4445633 (1984-05-01), Bonham, Jr.
patent: 4571688 (1986-02-01), Kashihara et al.
patent: 4597522 (1986-07-01), Kobayashi
patent: 4759073 (1989-07-01), Shah et al.
patent: 4855928 (1989-08-01), Yamanaka
patent: 4903883 (1990-02-01), Thurlemann et al.
patent: 5044543 (1991-09-01), Yamazaki et al.

Affiliated with

Also associated with

Rating

Wire bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-901063