Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

2007-07-13

2010-06-15

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S001100, C228S110100, C228S180500

Reexamination Certificate

active

07735707

ABSTRACT:
A wire bonding apparatus including a bonding arm provided at a tip end thereof with an ultrasonic horn that has a capillary at its tip end, wherein the bonding arm is provided therein with a pressure sensor that detects the pressing load applied by the capillary on a workpiece when bonding is executed. The bonding arm has a supporting point which is a thin-connecting portion and located at a height which is the same as the height of the center of gravity of a part formed by the capillary, ultrasonic horn body portion, ultrasonic vibrator, ultrasonic horn connecting portion, etc., and at a point where a balance between inertial mass including the capillary, ultrasonic horn body part, ultrasonic horn connecting portion, horn securing screws and pressure screws and inertial mass of the ultrasonic vibrator is maintained, when the bonding arm is turned about a bonding arm supporting shaft.

REFERENCES:
patent: 4815453 (1989-03-01), Cotrel
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patent: 5314105 (1994-05-01), Farassat
patent: 5890643 (1999-04-01), Razon et al.
patent: 6425514 (2002-07-01), Ou et al.
patent: 6513696 (2003-02-01), Ho et al.
patent: 2003-258021 (2003-09-01), None
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