Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1987-01-27

1988-08-23

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228179, B23K 3700

Patent

active

047655267

ABSTRACT:
An apparatus is provided with a capillary having a plurality of through holes. A plurality of bonding wires are delivered through the plurality of through holes at the same time from a wire supply unit. The apparatus connects a plurality of bonding wires to an element subject to bonding at the same time.

REFERENCES:
patent: 3627190 (1971-12-01), Ramsey

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