Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

2005-03-29

2005-03-29

Dunn, Tom (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S008000, C228S045000, C228S001100

Reexamination Certificate

active

06871772

ABSTRACT:
A wire bonding apparatus with a bonding head that includes an ultrasonic transducer having a capillary at its tip end, piezo-electric elements that form a pair of complementary action type extension and retraction driving elements which cause the ultrasonic transducer to move with respect to a transducer holder, an impact detection sensor, and a Z motor which drives the transducer holder. The piezo-electric elements are arranged so that when one of them is driven to extend, the other is driven to retract. When the impact detection sensor detects that the capillary is lowered by the Z motor and comes into contact with a bonding object (semiconductor chip), the driving of the Z motor is stopped, and the piezo-electric elements are driven to the directions of extension and retraction in a complementary manner, thus swinging the ultrasonic transducer and moving the capillary upward.

REFERENCES:
patent: 4603802 (1986-08-01), Kurtz et al.
patent: 4903883 (1990-02-01), Thurlemann et al.
patent: 5156320 (1992-10-01), Yanagida
patent: 5169050 (1992-12-01), Montagu
patent: 5323952 (1994-06-01), Kato et al.
patent: 5385288 (1995-01-01), Kyomasu et al.
patent: 5411195 (1995-05-01), Yamazaki et al.
patent: 5486733 (1996-01-01), Yamazaki et al.
patent: 6098868 (2000-08-01), Mae et al.
patent: 6786392 (2004-09-01), Nogawa

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