Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1988-11-23

1989-10-31

Godici, Nicholas P.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, 228110, B23K 2010

Patent

active

048771732

ABSTRACT:
A wire bonding apparatus which bonds electrodes and external leads of a semiconductor integrated circuit element, a bonding head, a heat block having a lead frame which supports the semiconductor integrated circuit element in a bonding position, and an ultrasonic horn fixed to the bonding head and generating ultrasonic waves to bond the electrodes and the external leads of the circuit element when the circuit element is in the bonding position, the ultrasonic horn being formed of a metallic material having a thermal expansion coefficent of not more than about 5.times.10.sup.-6 /.degree.C. so as to limit locational errors of the ultrasonic horn due to thermal expansion to a specified value.

REFERENCES:
patent: 3794236 (1974-02-01), Salzer et al.
patent: 4249986 (1981-02-01), Obeda
patent: 4566181 (1986-01-01), Matusik et al.
patent: 4641773 (1987-02-01), Morino et al.
Metals Handbook Ninth Edition, vol. 3, "Low Expansion Alloys", pp. 792-794, copy 1980.
"Operation and Maintenance Manual for the Model 10G Ultrasonic Controller and Ferroelectric Transducer Assembly", UtheTechnology, Inc., Jan. 1985.

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