Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

2000-02-14

2000-10-10

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

219 561, 219 8518, B23K 106, B23K 300

Patent

active

061292559

ABSTRACT:
A bonding apparatus comprising a capillary through which a wire passes, a torch electrode that makes a substantially horizontal pivotal movement so as to be brought under the capillary, and a rotary motor that drives the torch electrode, thus allowing the torch electrode to have any desired range of movement so as to provide superior working characteristics.

REFERENCES:
patent: 3806019 (1974-04-01), Diepeveen
patent: 5031821 (1991-07-01), Kaneda et al.
patent: 5433371 (1995-07-01), Morisako
patent: 5653380 (1997-08-01), Haji
patent: 5667130 (1997-09-01), Morita et al.
patent: 5676856 (1997-10-01), Haji et al.

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