Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1978-11-22

1981-05-12

Crane, Daniel C.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 1R, 228 7, 228 8, 74 43, 219 561, B23K 2000

Patent

active

042667100

ABSTRACT:
An apparatus for bonding wires on semiconductors is provided with a processor controlled vertical drive mechanism coupled to a novel bonding head of the type having a bonding tool mounted therein. The height of the bonding tool at the reset position and at the bonding position may be programmed into the processor for different semiconductor devices or workpieces. Indicating means are provided on the novel bonding head for establishing the reset position and the bonding positions so that the bonding tool is taught a series of predetermined vertical positions during a bonding cycle. The apparatus is also programmed to compute intermediate positions between said predetermined vertical positions to obtain optimum high speed movement of the bonding head and the bonding tool during subsequent bonding cycles.

REFERENCES:
patent: 3125906 (1964-03-01), Johnson
patent: 3451607 (1969-06-01), Miller
patent: 3863827 (1975-02-01), Foulke et al.
patent: 3940047 (1976-02-01), Laub
patent: 3941294 (1976-03-01), Johannsmeier
patent: 3954217 (1976-05-01), Smith

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