Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1993-03-24

1994-01-04

Ramsey, Kenneth J.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, B23K 2010

Patent

active

052753247

ABSTRACT:
A wire bonding apparatus in fabricating, for example, semiconductor devices including a bonding arm that is vertically and horizontally movable and has a capillary through which a bonding wire is passed. The bonding arm is provided with a piezoelectric element which transmits a vibration to the capillary via its electric strain effect or magnetic strain effect so that the capillary performs wire bonding. With the use of the piezoelectric element that is provided near the capillary, vibrational energy loss can be minimal, and the frequency and amplitude of the vibration can be changed during each bonding operation.

REFERENCES:
patent: 3384283 (1968-05-01), Mims
patent: 3602420 (1971-08-01), Wilkinson
patent: 3610506 (1971-10-01), Robinson

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