Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1983-09-15

1986-02-18

Smith, Jerry

Boots, shoes, and leggings

228 11, 228 8, 228102, 228110, G06G 764, B23K 106, B23K 500

Patent

active

045716889

ABSTRACT:
A wire bonding apparatus in which a supersonic oscillator is provided for applying a supersonic vibration to a capillary through the medium of a tool arm at the time of bonding, and the supersonic oscillator is controlled for the adjustment of the oscillation time and/or amplitude of supersonic oscillation to regularize the ball shape, while monitoring the deformation of a ball at the end of a wire by means of a gap sensor which detects the relative positions of the tool arm and a tool lifter arm.

REFERENCES:
patent: 3784079 (1974-01-01), Spanjes
patent: 4069961 (1978-01-01), Nicklaus et al.
patent: 4125943 (1978-11-01), Ando
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4409659 (1983-10-01), Devine
patent: 4438880 (1984-03-01), Smith et al.

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