Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1980-05-14

1982-09-07

McQuade, John

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 9, B23K 2800

Patent

active

043479642

ABSTRACT:
In a wire bonding apparatus in which, by identifying recognition marks of a pellet or leads displaced from a reference position in wire-bonding a pellet of a semiconductor device to leads within a field of view of a television camera, the displacements of the bonding positions of the pellet and the lead are corrected and then bonding pads on the pellet are connected to the leads by wires, the field of view is moved from a reference view position in a given moving manner, whereby the recognition marks may be identified rapidly and reliably. This apparatus is well adapted for the wire bonding of a semiconductor device of the DILG sealing type, for example, which is poor in the position accuracy of the bonding position.

REFERENCES:
patent: 3466514 (1969-09-01), Brunner et al.
patent: 3581375 (1971-06-01), Rottmann
patent: 3776447 (1973-12-01), Adams et al.
patent: 3928749 (1975-12-01), Herrmann
patent: 4010885 (1977-03-01), Keizer
patent: 4068371 (1978-01-01), Miller
patent: 4239144 (1980-12-01), Elles et al.

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