Wire bonding apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 12, 228103, H01L 2160

Patent

active

056533756

ABSTRACT:
A wire bonding apparatus includes a frame, an X, Y, table, installed on the frame, including a linear stepping motor with a first stator and a first inductor, a transducer, pivotably installed on the X, Y table, to one end of which a capillary for bonding wire is installed, a first transferring portion installed to the frame to make the other end of the transducer ascend so that the capillary for wire bonding ascends, a second transferring portion installed on the X, Y table in front of the first transferring portion to, thereby, make the other end of the transducer ascend during bonding, and a first location detecting portion installed to the frame and the X, Y table to detect an amount of movement in the X and Y directions so that energy loss according to the driving of a head portion can be reduced.

REFERENCES:
patent: 3894672 (1975-07-01), Arai et al.
patent: 4119259 (1978-10-01), Sakamoto
patent: 4856699 (1989-08-01), Schoepe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wire bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1069189

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.