Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1995-10-26
1997-08-05
Ramsey, Kenneth J.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 12, 228103, H01L 2160
Patent
active
056533756
ABSTRACT:
A wire bonding apparatus includes a frame, an X, Y, table, installed on the frame, including a linear stepping motor with a first stator and a first inductor, a transducer, pivotably installed on the X, Y table, to one end of which a capillary for bonding wire is installed, a first transferring portion installed to the frame to make the other end of the transducer ascend so that the capillary for wire bonding ascends, a second transferring portion installed on the X, Y table in front of the first transferring portion to, thereby, make the other end of the transducer ascend during bonding, and a first location detecting portion installed to the frame and the X, Y table to detect an amount of movement in the X and Y directions so that energy loss according to the driving of a head portion can be reduced.
REFERENCES:
patent: 3894672 (1975-07-01), Arai et al.
patent: 4119259 (1978-10-01), Sakamoto
patent: 4856699 (1989-08-01), Schoepe et al.
Ramsey Kenneth J.
Samsung Aerospace Industries Ltd.
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