Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1999-06-30

2000-09-19

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228102, 228 11, 228103, 228 8, B23K 106, B23K 520, B23K 3700, B23K 3112

Patent

active

061199141

ABSTRACT:
A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

REFERENCES:
patent: 3575333 (1971-04-01), Kulicke, Jr.
patent: 3997100 (1976-12-01), Hofmeister
patent: 4676492 (1987-06-01), Shamir
patent: 5044543 (1991-09-01), Yamazaki et al.
patent: 5060841 (1991-10-01), Oshima et al.
patent: 5156320 (1992-10-01), Yanagida
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5443200 (1995-08-01), Arikado
patent: 5501388 (1996-03-01), Takeuchi
patent: 5566876 (1996-10-01), Nishimaki et al.

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