Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1989-10-31

1991-05-21

Heinrich, Sam

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 9, 228104, H05K 332, H01L 2160, B23K 2026

Patent

active

050168037

ABSTRACT:
A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor is prevented from contacting the bonding wire. Thus, the presence of the bonding wire is detected by the optical sensor which senses when the bonding wire is in contact with the wire-contact.

REFERENCES:
patent: 4019669 (1977-04-01), Tanimoto et al.
patent: 4210270 (1980-07-01), Garner
patent: 4598853 (1986-07-01), Hill
patent: 4817848 (1989-04-01), Gabaldon
patent: 4854494 (1989-08-01), von Raben
patent: 4909431 (1990-03-01), Japachino et al.

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