Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1982-05-11
1984-04-24
Godici, Nicholas P.
Metal fusion bonding
Process
With condition responsive, program, or timing control
H01L 2158
Patent
active
044443498
ABSTRACT:
A method for high speed bonding of fine wires to electrodes includes a method of teaching the wire bonding tool the exact point of engagement of the bonding tool with the semiconductor. The bonding position point of engagement is employed to calculate a tolerance inflection point representative of the point in space where the bonding tool must start a constant velocity approach to the first bonding position. In similar manner, the point of engagement of the bonding tool with the semiconductor is determined and from that position a reset point is calculated representative of point in space where the bonding tool will start its rapid decelleration approach to the tolerance inflection point. The bonding tool may then be acceleration toward the bonding position with optimum speed without crashing into the semiconductor.
REFERENCES:
patent: 3943343 (1976-03-01), Irie
patent: 3958740 (1976-05-01), Dixon
patent: 4073424 (1978-02-01), Kulicke et al.
Bilane Glenn B.
Rubin Lawrence M.
Soffa Albert
Vilenski Dan
Godici Nicholas P.
Jordan M.
Kulicke & Soffa Industries Inc.
Sowell John B.
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