Wire bonder with controlled atmosphere

Details Wire bonder with controlled atmosphere Wire bonder with controlled atmosphere

1983-11-23

1985-10-22

Shaw, Clifford C.

Electric heating

Metal heating

Wire, rod, or bar bonding

219 68, B23K 1122

Patent

active

045490597

ABSTRACT:
In order to bond a fine metal wire of a high tensile strength or a low cost to an electrode of a semiconductor chip and an external lead of a semiconductor device package, either an inert gas or an inert gas containing a predetermined concentration of oxygen is made to flow through a region in which the tip of the fine metal wire is melted by a spark discharge, parallel to the path of the discharge.

REFERENCES:
patent: 4323759 (1982-04-01), Edson et al.
patent: 4390771 (1983-06-01), Kurtz et al.

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