Wire bonder with bonding arm angle sensor

Details Wire bonder with bonding arm angle sensor Wire bonder with bonding arm angle sensor

1992-02-25

1993-01-19

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 8, B23K 2010, H05K 1306

Patent

active

051800942

ABSTRACT:
A wire bonder processes an angle sensor which detects, without making contact, the angle of rotation of a bonding arm provided so as to be allowed to freely oscillate centered on a shaft supported by a head base, and is able to easily determine the amount of movement of a bonding tool and a distance to a bonding stage.

REFERENCES:
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 5080276 (1992-01-01), Kashima et al.

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