Wire bonder system

Details Wire bonder system Wire bonder system

1993-08-31

1995-01-03

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, 228 565, H01L 2160

Patent

active

053778944

ABSTRACT:
A wire bonder system comprising mounting a tool for ultrasonic bonding onto a transducer and the tool is protruded from the transducer with its bonding side to supply the high frequency electric power to the transducer. The protruded length of the tool is adjusted so as to avoid the length protruded from the transducer to minimize the high frequency electric power.

REFERENCES:
patent: 4208001 (1980-01-01), Martner
patent: 4781319 (1988-11-01), Deubzer et al.
patent: 4808948 (1989-02-01), Patel et al.
patent: 5180093 (1993-01-01), Stansbury et al.
patent: 5244140 (1993-09-01), Ramsey et al.

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