Wire bonder for improved bondability of a conductive wire...

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Reexamination Certificate

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Details

C228S180500, C228S042000, C219S085160, C219S085180, C219S056100

Reexamination Certificate

active

07938308

ABSTRACT:
A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.

REFERENCES:
patent: 4976393 (1990-12-01), Nakajima et al.
patent: 7628307 (2009-12-01), Wong et al.
patent: 63111635 (1988-05-01), None
patent: 02133933 (1990-05-01), None
patent: 05109808 (1993-04-01), None

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