Wire bonder and wire bonding method

Details Wire bonder and wire bonding method Wire bonder and wire bonding method

1994-03-29

1996-10-22

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228 9, 2281805, 228104, H01L 2160

Patent

active

055668763

ABSTRACT:
The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.
This wire bonder is able to compare and evaluate at least one set of image data of either a first bonding point or second bonding point in the form of bonded sites, or a wire spread between said first and second bonding points, with the positional data into which said image data has been incorporated in advance, and automatically perform inspection and make corrections.

REFERENCES:
patent: 5145099 (1992-09-01), Wood et al.
patent: 5351872 (1994-10-01), Kobayashi

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