Wire bonder and wire bonding method

Details Wire bonder and wire bonding method Wire bonder and wire bonding method

1994-03-29

1995-10-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228 9, 2281805, H01L 2160

Patent

active

054564034

ABSTRACT:
The present invention provides a wire bonder and its method that is able to automatically inspect whether an initial ball set with a keyboard has been formed.
Ball formed on the end of a wire fed from capillary is placed on lead by driving of a bonding head, and the diameter of that ball is measured by photographing that ball by a camera after bonding a portion of the wire to which ball is connected.

REFERENCES:
patent: 5145099 (1992-09-01), Wood et al.
patent: 5221027 (1993-06-01), Terakoda et al.
patent: 5356065 (1994-10-01), Kobayashi

Affiliated with

Also associated with

Rating

Wire bonder and wire bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonder and wire bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonder and wire bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2305695