Wire bonder and wire bonding method

Details Wire bonder and wire bonding method Wire bonder and wire bonding method

1994-03-29

1995-10-17

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228 9, 228104, 2281805, H01L 2160

Patent

active

054582806

ABSTRACT:
The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.
A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a ball that has been bonded is present within a specified range at a location specified in advance and/or centering on said location.

REFERENCES:
patent: 5145099 (1992-09-01), Wood et al.
patent: 5156320 (1992-10-01), Yanagida
patent: 5221037 (1993-06-01), Terakado et al.
patent: 5356065 (1994-10-01), Kobayashi

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