Wire bonder and wire bonding method

Details Wire bonder and wire bonding method Wire bonder and wire bonding method

1992-02-25

1992-10-20

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, 228 45, 228 9, H01L 2160

Patent

active

051563207

ABSTRACT:
A wire bonder and wire bonding method where there is repeatedly calculated the dislocation dy of the end of a capillary, based on the oscillation an elevation angle of a bonding arm which performs oscillating motion, on the end of which said capillary is provided. As a result of controlling the driving of an XY table based on the dislocation dy, the position of the end of the capillary is successively corrected so that the end of said capillary is positioned on a straight line which connects a first bonding point and a second bonding point.

REFERENCES:
patent: 5080276 (1992-01-01), Kashima et al.

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