Wire bonder and vacuum pedestal workholder for same

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

439 41, 439 42, 228 45, 257697, B23K 3700, H01L 2302, H01R 1360

Patent

active

052605140

ABSTRACT:
A fully-populated Pin Grid Array (PGA) is vacuum-chucked to a pedestal, without mechanical clamping. The pedestal includes a cylindrical shaft having a vacuum passageway extending its length, and a vacuum reservoir block mounted atop the shaft, and an alignment/fixture plate mounted atop the vacuum reservoir block. The alignment/fixture plate is provided with holes extending partially through the plate, at least about its periphery, for receiving the outermost rows/columns of pins of the PGA, while maintaining a vacuum seal. In one embodiment, a central portion of the alignment/fixture plate is provided with a large through-opening for receiving the remaining pins of the PGA. In another embodiment, the central portion of the alignment/fixture plate is provided with a plurality of individual through holes corresponding to the remaining pins of the PGA. In this manner, the PGA is held securely and well aligned within a wire bonder, while avoiding damaging the pins.

REFERENCES:
patent: 4759073 (1988-07-01), Shah et al.
patent: 4762267 (1988-08-01), Shimizu
patent: 4818238 (1989-04-01), Borg
patent: 5000697 (1991-03-01), Murphy

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